- Siemens and Intel are partnering to collaborate on advancing the digitalization and sustainability of Intel’s semiconductor manufacturing, the companies announced this week.
- The deal focuses on ways to improve chip manufacturing efficiency, evolving factory operations and cybersecurity, as well as minimizing carbon footprints.
- As part of the memorandum of understanding, Intel will explore product- and supply chain-related modeling solutions to cut emissions, while Siemens will create data-based insights to analyze product-related emissions.
The partnership between the two companies aims to enhance sustainability in the semiconductor production process across Scopes 1, 2 and 3 of the supply chain. It will use advanced natural resources and environmental footprint modeling to minimize energy consumption, according to the release.
In 2022, Intel committed to reaching net-zero Scope 1 and 2 greenhouse gas emissions by 2040. The company expanded its sustainability goals this year to also include reaching net-zero upstream Scope 3 GHG emissions by 2050.
One of the ways Siemens and Intel will work to achieve this is by using digital twins to standardize solutions and boost efficiency for capital-intensive manufacturing facilities.
Siemens is known for its use of digital twins and data analysis to improve the sustainability of chipmaking. The tech company develops hardware and software solutions by working with both semiconductor manufacturers as well as chip equipment makers.
"Few things run without chips. Therefore, we’re proud to collaborate with Intel to quickly advance semiconductor production,” Cedrik Neike, CEO of Siemens Digital Industries, said in the release.
“Siemens will bring its entire cutting-edge portfolio of IoT-enabled hardware and software and electrical equipment to this collaboration. Our joint efforts will contribute to achieving global sustainability goals,” Neike added.
Intel has been taking on major domestic semiconductor manufacturing projects in the past few years. In September 2022, the company broke ground on a $20 billion semiconductor manufacturing site in Licking County, Ohio.
This summer, Intel also restructured its manufacturing business to act as a standalone unit, a key step to become a major contract chipmaker and save up to $10 billion in costs.